Pico 4 Ultra is the first true Quest 3 competitor, with the same powerful Snapdragon XR2 Gen 2 chipset
Mobile System on a Chip (SoC) with DRAM on the package (like Apple Silicon)
Manufacturing and packaging by TSMC, only the “base tile” as a connecting link comes from Intel
8 cores: 4 performance cores (P-cores) and 4 efficiency cores (E-cores)
P-Cores: Lion Cove, +14% IPC vs. Raptor Cove (14th Gen Core)
E-cores: Skymont, +2% IPC vs. Raptor Cove (14th Gen Core), +68% IPC vs. Meteor Lake (LPE)
The cores will be used by Arrow Lake (Core Ultra 200 in the desktop) and from 2025 Xeon
iGPU: Premiere for Xe2 (i.e. used in Battlemage)
NPU with 48 TOPS for Windows Copilot+
+30% en IPC
pas contre grosse mesquinerie, certains CPU sont limités à 16Go de RAM merveilleux ...
sans compter de la RAM soudée !!
the overall construct is made up of various chips (tiles) on a common package, which for the first time also contains the DRAM -
All Core Ultra 200Vs always use LPDDR5X memory – soldered onto the package. The process is simple: if the model number ends with 6V, 16 GB are installed on the package. If the number ends with 8V, it is always 32GB LPDDR5X-8533.
New media engine for VCC alias H.266
Écouté hier
C'est top !
"HOT STUFF vous propose du lundi au vendredi, de 22h à minuit"
Plutôt pour 2025
Mais on devrait pas avoir besoin de heatsink
Grâce à la conso en baisse
Dommage un autre très bon site :(
230 engagés
et beau plateau
L'ancien de Clubic !
Ryzen AI 9 HX 370
vraiment performant et très efficient !
Almost 32 hours under ideal conditions
(minimum luminosity, WLAN off, virtually no load) are just as excellent
as around 16.5 hours for wireless Internet
+Pro
true-to-color, responsive & high-contrast panel
excellent battery life
good input devices
strong processor
compact & light
chic design
fast iGPU
USB 4
- Contra
Surface temperatures under load
Housing could be more stable
RAM & radio module soldered
Display reflects very much
lame card reader
just an M.2 slot
à voir si c'est fiable c'est via site web